Press Kit - Aries Electronics

New Switch-A-Pitch Adapters from Aries Provide Even Smaller Pitch Landing Pads for Use on Larger Pitch Boards

New Fine Pitch Bump Adapters from Aries Enable Use of Alternate ICs on PCBs Originally Designed for TSSOPs and QFP Packages

Adjustable Pressure Pad on New Aries Electronics' CSP Test Socket Enables Testing of Extremely Small and Fragile Devices without Damage

New Switch-A-Pitch Adapters from Aries Electronics Enable Use of Smaller Pitch Devices with More Cost-effective, Larger Pitch Boards

Aries Electronics Patented CSP/BallNest Hybrid Socket Provides Reliable, Consistent Test and Burn-in Down to 0.30 mm Pitch

New 0.3 mm Pitch RF and Test & Burn-in Sockets for Devices Up to 6.5 mm Squared Available from Aries Electronics

Aries Electronics' New 6.5 mm Center Probe Test Socket Features Versatile Design Ideal for Test and Burn-In

Aries Electronics' New Test and Burn-In and RF Sockets Now Accommodate Pitches Down to 0.3 mm

Aries Electronics' New CSP/MicroBGA Test and Burn-In Socket Now Accommodates Devices up to 6.5 mm Squared