Press Room - Aries Electronics
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- SEMICON West 2011
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Records 1 to 5 of 49
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December 19, 2011
New Aries CSP Sockets Enable Testing of Any Area-array Device to +200 Degrees C
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March 29, 2011
Roy Larsen of Larsen Associates Receives Aries Electronics' 2010 Rep of the Year Award
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February 8, 2011
Fine Pitch Bump Adapters from Aries Allow for SMT Adaptation of TSSOP, QFP and other Fine-Pitch Devices
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January 7, 2011
Aries' Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30 mm
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August 3, 2010
New Fine Pitch Bump Adapters from Aries Allow BGA Devices of Any Pitch to be Used with 0.40 mm Pitch Boards
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Records 1 to 5 of 49